Thin-Film RC Networks

Product Description   General-purpose microwave ceramic chip capacitors are mainly used in microwave integrated circuits (MICs)for DC blocking, RF bypass, source bypass, andimpedance matching.   They feature small size, high capacitance, excellent microwave performance, and an applicable frequency range from DC to 100 GHz. The surface gold electrodesare suitable for gold-wire and gold-ribbon bonding.    

Product Description   Mainly used in microwave integrated circuits (MICs) for DC blocking, RF bypass, source bypass, and impedance matching.   Easy to mount, it can reduce the lead length and enhance performance in IC packaging, while reducing the complexity and cost of assembly.

Product Description   Mainly used for impedance matching, parallel resonant circuits, dielectric-resonance tuning, and coupling.   Easy to mount and suitable for circuit design and adjustment.

Product Description   Mainly used in high-voltage filtering, bypass etc..   Small size and high capacitance (1 nF~10 μF), with good capacitance temperature coefficient and high operating voltage up to 100 V.

Product Description   Mainly used in microwave integrated circuits (MICs) for DC blocking, RF bypass, source bypass, and impedance matching.   General specification is GJB2442-2021, detail specification is ZZR-Q/TJKJ20007-2019, CTK1101SG general-purpose single-layer chip ceramic fixed capacitor with failure-rate level, and standard number is JLCH61020094, featuring excellent microwave performance with applicable frequency of 100 kHz~100 GHz, and surface gold electrodes suitable for gold-wire and gold-ribbon bonding.

Product Description   General specification is GJB2442-2021, detail specification is ZZR-Q/TJKJ20008-2019, CTK1101SA array-type single-layer chip ceramic fixed capacitor with failure-rate level, and standard number is JLCH61020095.   It features easy to mount, shorter lead length and high performance in IC assembly, low assembly complexity and low cost.

I. Applications Mainly used in microwave integrated circuits (MICs) to reduce circuit area and component cost.   II. Features ◼ Resistors and capacitors are integrated together, reducing the number of components; ◼ Gold wire bonding is possible; ◼ Tantalum nitride film.

I. Applications It is mainly used for manufacturing thin-film circuits, microwave ceramic chip capacitors, etc.   II. Features ◼ high quality factor, high dielectric constant14~150; ◼ Near-zero resonant-frequency temperature coefficient, providing excellent temperature stability; ◼ Flat substrates, available up to 2 inches; ◼ Can be used to fabricate microwave ceramic chip capacitors, thin-film circuits, microwave dielectric antennas, and other components.